BOBST looks back at successful open house COMPETENCE 18


Impressions from COMPETENCE 18 (photo: BOBST)
Impressions from COMPETENCE 18 (photo: BOBST)

COMPETENCE 18, this year’s Open House event at BOBST, attracted over 600 visitors, including many of the leading packaging and label manufacturers and converters in the industry. The event, which took place on 5-8 June 2018 at the Competence Center of Bobst Mex, Switzerland, promised to show the “Solutions for the challenge of tomorrow,” addressing key trends facing packaging converters, such as the need for shorter runs, greater versatility, e-commerce and constant innovation.

“We develop our solutions with our customers in mind and all the direct feedback we receive at events like this helps us to improve even further,” said Philippe Milliet, head of business unit Sheet-fed. “Many attendees were surprised by the pure breadth of what BOBST offers. BOBST is an expert in substrate processing, converting and printing, and it was very rewarding being able to demonstrate several of the company’s most innovative solutions first-hand, and to talk with visitors about the very tangible difference we can make to their businesses, now and in the future.”

Attendees were able to see live demonstrations of selected key BOBST machines, and to hear from BOBST Services on some exciting developments.

Highlights included the live demonstration of folder-gluer EXPERTFOLD 165 with the automated packer SPEEDPACK, the natural extension of a corrugated folder-gluer. SPEEDPACK bundles a large range of box formats and types, from solid board up to double wall corrugated board boxes, delivering perfect and smooth high-speed packing.

In addition, attendees had the chance to see EXPERTFOIL 142 in action, the only genuine size VI hot-foil-stamper in the world, and the only one with 600t of embossing pressure. It allows users to put more blanks on every sheet – up to six in format VI instead of only two in format IIIb - meaning margins can be increased on a whole range of jobs.