Rockwell Automation becomes part of the OPC UA Time-Sensitive-Networking Initiative
Rockwell Automation (Milwaukee, Wisconsin) joins industry leaders ABB, Belden, Bosch Rexroth, B&R, Cisco, Hilscher, KUKA, National Instruments, Phoenix Contact, Pilz, Schneider Electric, TTTech and WAGO (collectively known as “Shapers”) to develop a communications solution for real-time and sensor-to-cloud industrial applications. The OPC UA-based solution enables simple and secure use of information across different manufacturer systems. In addition, TSN (time-sensitive networking) improves latency and robustness in converged industrial networks.
“Connecting systems from multiple vendors requires a harmonised, interoperable solution that provides both consistent information models and consistent communication and application behaviour (collectively known as application profiles)”, said Paul Brooks, business development manager at Rockwell Automation. “To achieve this goal, experts from the individual automation companies are working together on a solution. This offers manufacturing and industrial companies harmonised application profiles for I/O, motion and safety devices,” said Sebastian Sachse from B&R Industrial Automation.
The new OPC UA TSN solution ensures the interoperability of different manufacturer solutions in the same network. To this end, the companies work together with industry consortia such as Avnu, IEEE, IIC, LNI 4.0 and the OPC Foundation. The companies will announce the exact procedure for harmonising the application profiles in the middle of the year. This takes the final hurdle to full interoperability. Part of the goal is the certification of the complete solution from a single source - right down to the application profile level.
These companies have already published whitepapers on OPC UA TSN technology, such as an IIC white paper on "Converged Traffic Types". They also made an important contribution to the recently released PubSub extension of OPC UA and plan collaboration between the IIC and LNI testbeds.